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  • SoC & Chiplet Architecture
  • Design-for-Test
  • Functional Safety

Varun Singh

I work on how large chips are architected, designed, connected, tested, and proven correct.

Digital design and DFT leader with 10+ years across SoC integration, system IP development, and test infrastructure. Delivered 5+ high-volume production SoCs and 2 production IPs for automotive, industrial, and AI markets.

Varun Singh
Dallas–Fort Worth, TX10+ yrs

Industry experience

  1. Tenstorrent

    2026 –

    AI & HPC silicon

  2. Cadence

    2022 – 2026

    IP R&D

  3. Texas Instruments

    2017 – 2022

    Automotive & industrial SoCs

  4. Luxima Technology

    2016 – 2017

    CMOS image sensors

U.S. patents
12issued

6 invention families · 3 more pending

production SoCs
5+shipped

Automotive, industrial, AI

in silicon
10+years

Across 16nm to 1.4nm nodes

production IPs
2commercial

NoC and DFT infrastructure

Selected work

Four programmes that shipped, spanning interconnect, test infrastructure, and full-lifecycle SoC integration.

  1. 01Cadence · 2022–26

    JANUS non-coherent NoC IP

    Design lead for a packet-based, wire-optimized, generatable, FuSa-compliant network-on-chip. Now offered commercially as Cadence IP.

    • NoC
    • ISO 26262
    • RTL generation
  2. 02Cadence · 2023–26

    DFT-specific test network

    Pioneered a network architecture that distributes test across an SoC automatically, in-field or on ATE. Validated on advanced-node (1.4nm) customer test chips.

    • DFT
    • In-field test
    • 1.4nm
  3. 03Texas Instruments · 2017–22

    Memory self-repair & PBIST

    Architected improved memory built-in self-repair delivering measurable yield gain and reduced FIT rate in production, plus 16nm PBIST infrastructure for ASIL-D certification.

    • MBIST
    • Yield
    • ASIL-D
  4. 04Texas Instruments · 2017–22

    TDA4 & AM64x SoC integration

    Microarchitect for clocking, debug, and power on the Jacinto 7 ADAS platform; led top-level integration across 5+ automotive and industrial SoCs.

    • SoC integration
    • ADAS
    • 16nm
Full experience →

Education & certification

  • M.S. Electrical Engineering

    University of Southern California · 2017

  • B.Tech. Electronics & Communication

    SRM Institute of Science and Technology · 2015

  • ISO-26262 Functional Safety Engineer

    SGS-TÜV Saar

  • ISO/SAE 21434 Cybersecurity Engineer

    TÜV SÜD